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june 2013 docid023194 rev4 1/17 AN4111 application note bal-nrf01d3 matched balun with integrated harmonics filter for nordic semiconductor ultralow power transceivers introduction the nrf24le1, nrf24ap2, nrf51422 and nrf51822 qfn from nordic semiconductor are 2.45 ghz combo chips with an ultralow power transceiver. the bal-nrf01d3 from stmicroelectronics is an ultra miniature balun for which the matching impedance has been customized for the nrf24le1 qfn-32, nrf24ap2-1ch, nrf24ap2-8ch, nrf51422-qfaa, and nrf51822 -qfaa nordic semiconductor circuits. the bal-nrf01d3 integrates matching network and harmonics filters. it uses stmicroelectronics? ipd technology on non-c onductive glass substrate which optimizes rf performance. compared to traditional discrete solutions ( figure 3 ), stmicroelectro nics bal-nrf01d3 decreases the bom count by 80%, from 5 components to 1 component ( figure 4 ). this results in a lower s ystem cost solution. the bal-nrf01d3 has been tested and approved by nordic semiconductor in the nrf2723 nrfgo module (from the nrfgo nrf24le1 qfn-32 pins development kit) and the nrf2752 nrfgo module (from the nrfgo nrf51x22 developer preview kit). the bal-nrf01d3 demonstrates a higher system performance compared to traditional solutions. this document presents the test and performance results. www.st.com
bal-nrf01d3 preview AN4111 2/17 docid023194 rev4 1 bal-nrf01d3 preview 1.1 features ? 50 ? nominal input / conjugate match to nordic semiconductor chips nrf24le1 qfn32, nrf24ap2-1ch, nrf24ap2-8ch, nrf51422-qfaa and nrf51822-qfaa ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? small footprint: < 1.5 mm 2 benefits ? very low profile: < 595 m after reflow ? high rf performance ? rf bom and area reduction applications ? 2.45 ghz impedance matched balun filter ? optimized for nordic's chip set nrf24le1/ap2 and nrf51 series 1.2 description stmicroelectronics bal-nrf01d3 is an ultra miniature balun. the bal-nrf01d3 integrates matching network and harmoni cs filter. matching impedance has been customized for the following nordic semiconductor circuits: nrf24le1 qfn-32 pins, nrf24ap2-1ch, nrf24ap2-8ch, nrf51422-qfaa and nrf51822-qfaa. the bal-nrf01d3 uses stmicroelectronics ipd technology on non-conductive glass substrate which optimize rf performances. the bal-nrf01d3 has been tested and approved by nordic semiconductor in their nrf2723 and nrf2752 nrfgo modules. 1.3 flip chip package figure 1. package 5 bumps figure 2. pin out diagram (top view) lead-free flip-chip package 5 bumps se diff diff vcc gnd a b c 1 2 3
docid023194 rev4 3/17 AN4111 benefits of bal-nrf 01d3 reference design 2 benefits of bal-nrf01d3 reference design figure 3. traditional discrete solution for nrf24le1 figure 4. nrf24le1 solution using bal-nrf01d3 using bal-nrf01d3 no external components are required for matching and for harmonic filtering. only a 2.2 nf extern al capacitor is required for v dd decoupling. the test board for nrf24le1 is shown in figure 8 . balun + filter gnd 15pf c2 15pf c1 16mhz x1 gnd 100nf c11 vcc_nrf gnd 100nf c9 33nf c8 gnd gnd vcc_nrf gnd vcc_nrf gnd p1.4 p1.3 p1.1 p1.0 p0.2 p 0.3 p0.4 p0.5 p0.6 pr o g p0.7 100nf c7 gnd 33nf c10 reset 22k r1 1% 0r r4 0r r5 0r r6 0r r7 0r r8 0r r9 0r r10 0r r11 0r r12 ain2 ain3 ain4 ain5 ain6 ain7 ain8 ain9 ain10 6.8n l1 2.2nf c3 na c4 4.7n l3 6.8n l2 1.5p c5 1.0p c6 gnd gnd gnd nrf24le1f16q32 p0.1 1 vdd 2 vss 8 p0.3 7 p0.4 10 dec1 3 dec2 4 p0.5 11 p0.6 12 pr o g 6 p0.7 13 vdd 9 p1.0 14 p1.1 15 p1.2 16 p1.3 17 p1.4 18 p1.5 28 p1.6 29 reset 19 vdd_pa 20 ant1 21 ant2 22 vss 23 vdd 24 iref 25 vss 26 vdd 27 xc1 30 xc2 31 p0.0 32 nrf24le1 p0.2 5 u1 p1.5 p 1.6 p1.2 p0.0 p 0.1 0r r2 0r r3 ain0 ain1 1 2 3 4 5 6 p4 15pf c17 15pf c18 gnd 1 2 32.768khz x2 j1 gnd 15pf c2 15pf c1 16mhz x1 gnd 100nf c11 vcc_nrf gnd 100nf c9 33nf c8 gnd gnd vcc_nrf gnd vcc_nrf gnd p1.4 p1.3 p1.1 p1.0 p0.2 p0.3 p0.4 p0.5 p0.6 prog p0.7 100nf c7 gnd 33nf c10 reset 22k r1 1% 0r r4 0r r5 0r r6 0r r7 0r r8 0r r9 0r r10 0r r11 0r r12 ain2 ain3 ain4 ain5 ain6 ain7 ain8 ain9 ain10 2.2nf c3 na c4 gnd gnd nrf24le1f16q32 p0.1 1 vdd 2 vss 8 p0.3 7 p0.4 10 dec1 3 dec2 4 p0.5 11 p0.6 12 prog 6 p0.7 13 vdd 9 p1.0 14 p1.1 15 p1.2 16 p1.3 17 p1.4 1 8 p1.5 28 p1.6 29 reset 19 vdd_pa 20 ant1 21 ant2 2 2 vss 2 3 vdd 24 iref 25 vss 26 vdd 27 xc1 30 xc2 31 p0.0 32 nrf24le1 p0.2 5 u1 p1.5 p1.6 p1.2 p0.0 p0.1 0r r2 0r r3 ain0 ain1 1 2 3 4 5 6 p4 15pf c17 15pf c18 gnd 1 2 32.768khz x2 j1 gnd ant1 2 ant2 1 vdd_pa 3 gnd 4 se 5 u2 bal-nrf01d3
benefits of bal-nrf01d3 reference design AN4111 4/17 docid023194 rev4 figure 5. traditional discrete solution for nrf51822 figure 6. nrf51822 solution using bal-nrf01d3 using bal-nrf01d3 only a 0.8 pf capacitor is needed for molding and for harmonic filtering. a 2.2 nf external capacitor is required for v dd decoupling. the test board for nrf51822 is shown in figure 14 .
docid023194 rev4 5/17 AN4111 benefits of bal-nrf 01d3 reference design figure 7 demonstrates two essential benefits of the bal-nrf01d3. ? decrease in the bom count by 80%, from 5 components to 1 component ? more than 80% pcb area reduction compared to the traditional discrete solution figure 7. pcb area comparison between bal-nrf01d3 and discrete solution compared to discrete solution s, the bal-nrf01d3 solution is much easier to implement. thanks to this smart implementation: ? no rf measurement tools and rf skills are required to design and validate the function. ? performance is less sensitive to component placement. ? pcb design is symmetrical from differential output to antenna, providing much shorter traces between transceiver outputs to the balun. as a result, st bal-nrf01d3 reduces harmonics generation. ?traditional? discrete solution bal-nrf01d3 solution
measured performances AN4111 6/17 docid023194 rev4 3 measured performances 3.1 nordic semiconductor nrf2 723 nrfgo module (nrf24xx) figure 8. nrf2723 st balun reference nrfgo module from nordic semiconductor table 1. main parameter measurements (2402 to 2480 mhz) parameter values parameter values pa_tx_fund (-18 dbm) -17.1 pa_tx_5h (0 dbm) -53.7 pa_tx_fund (-12 dbm) -8.7 2lo (0 dbm) -72.1 pa_tx_fund (-6 dbm) -3.0 lo (0 dbm) -68.8 pa_tx_fund (-0 dbm) 1.1 lo/2 (0 dbm) -67.5 pa_tx_2h (0 dbm) -39.1 lo/4 (0 dbm) -79.1 pa_tx_3h (0 dbm) -47.5 lo/8 (0 dbm) -80.1 pa_tx_4h (0 dbm) -47.5 receiver sensitivity [dbm] @ 1 mbps -85.6 bal-nrf01d3
docid023194 rev4 7/17 AN4111 measured performances figure 9. output power carrier figure 10. second harmonic mkr2 2.44000 ghz 1.231 dbm span 100 mhz sweep 4 ms (401 pts) ref 0 dbm peak log 10 db/ center 2.44 ghz #res bw 1 mhz vbw 1 mhz marker 1 2 3 trace (1) (1) (1) type freq freq freq x axis 2.40200 ghz 2.44000 ghz 2.48000 ghz amplitude 1.275 dbm 1.231 dbm 0.934 dbm atten 10 db mkr1 4.88000 ghz -40.95 dbm ref 0 dbm peak log 10 db/ atten 10 db span 200 mhz sweep 4 ms (401 pts) center 4.88 ghz #res bw 1 mhz vbw 1 mhz m1 s2 s3 fc aa
measured performances AN4111 8/17 docid023194 rev4 figure 11. third harmonic figure 12. fourth harmonic mkr1 7.413125 ghz -44.71 dbm ref 0 dbm peak log 10 db/ atten 10 db span 250 mhz sweep 4 ms (401 pts) center 7.32 ghz #res bw 1 mhz vbw 1 mhz m1 s2 s3 fc aa mkr1 9.72450 ghz -47.61 dbm ref 0 dbm peak log 10 db/ atten 10 db span 300 mhz sweep 4 ms (401 pts) center 9.75 ghz #res bw 1 mhz vbw 1 mhz m1 s2 s3 fc aa
docid023194 rev4 9/17 AN4111 measured performances figure 13. receiver local oscillator leakage (rx_lo) 3.2 nordic semiconductor nrf2 752 nrfgo module (nrf51xx) the results presented in this section are based on measurements performed with the nrf51822 nrfgo module and the bal-nrf01d3. the bal-nrf01d3 balun offers high suppression of 2 nd to 4 th harmonics and simplifies implementation of nrf51822 as regards to fcc and etsi compliance tests. figure 14. nrf2752 st balun reference nrfgo module from nordic semiconductor mkr1 2.83650 ghz -62.55 dbm ref -40 dbm peak log 10 db/ atten 5 db span 100 mhz sweep 4 ms (401 pts) center 2.79 ghz #res bw 1 mhz vbw 1 mhz m1 s2 s3 fc aa bal-nrf01d3
measured performances AN4111 10/17 docid023194 rev4 3.3 high power case at high power output (4dbm mode), the optimal impedance changes slightly. to optimize performance and output power on 4dbm mode, adding a 0.8 pf high q capacitor on the single port of bal-nrf01d3 is recommended. this capacitor leads to a 1 db gain on 4 dbm mode without impacting the 0 dbm mode. this capacitor must be added as close as possible to the single port of the bal-nrf01d3 (see section 3.5: layout recommendations for nrf51xxx ) and must be connected to ground. see figure 15 . figure 15. capacitor placement for high power case table 2. main parameter measurements (2402 to 2480 mhz) parameter values parameter values pa_tx_fund (0 dbm) 1.3 p a_tx_4h (4 dbm) -51.1 pa_tx_fund (4 dbm) 4.5 p a_tx_5h (0 dbm) -53.7 pa_tx_2h (0 dbm) -36.8 pa_tx_5h (4 dbm) -53.7 pa_tx_2h (4 dbm) -42.8 2lo (0 dbm) -59.8 pa_tx_3h (0 dbm) -48.8 lo (0 dbm) -61.6 pa_tx_3h (4 dbm) -40.7 lo/2 (0 dbm) -71.8 pa_tx_4h (0 dbm) -50.7 receiver sensitivity [dbm] @ 1 mbps -91.02 added capacitor bal-nrf01d3
docid023194 rev4 11/17 AN4111 measured performances 3.4 layout recommend ations for nrf24le1 figure 16. pcb overview figure 17. nrf24le1 exposed pads exposed pad length = 3700m exposed pad width = 3700m
measured performances AN4111 12/17 docid023194 rev4 figure 18. nrf24le1 land pattern metrics figure 19. nrf24le1 and bal-nrf01d3 position land pattern ? exposed pad distance = 175m land pattern width = 300 m land pattern length = 850m center of qfn land pattern to bal-nrf01d3 bump center = 815 m
docid023194 rev4 13/17 AN4111 measured performances 3.5 layout recommend ations for nrf51xxx figure 20. nrf51xxx exposed pad dimensions figure 21. nrf51xxx land pattern metrics 4700 m exposed pad dimensions: 4700m x 4700 m 4700 m 340 m 660 m 200 m b1 = bal-nrf01d3
measured performances AN4111 14/17 docid023194 rev4 figure 22. bal-nrf01d3 position figure 23. 0.8 pf high q capacitance position center of qfn land pattern to bal-nrf01d3 bump center 960 m bal-nrf01d3 bump center to 0402 capacitor pad center 812m
docid023194 rev4 15/17 AN4111 measured performances figure 24. pcb stack-up recommendation figure 25. more layout information at nordic semiconductor?s web site copper plating 18 m copper layer copper plating 18 m copper layer 1 2 1.6 mm 1.6 mm fr4, ipc-4101c/21 1.6 mm 1 oz
ordering information AN4111 16/17 docid023194 rev4 4 ordering information 5 revision history table 3. ordering information part number marking weight base qty delivery mode bal-nrf01d3 sc 1.82 mg 5000 tape and reel table 4. document revision history date revision changes 13-july-2012 1 initial release. 12-nov-2012 2 added figure 14 and figure 15 . updated text after figure 7 . added section 3.2: nordic semiconductor nrf2752 nrfgo module (nrf51xx) and section 3.3: high power case . 04-mar-2013 3 updated name of developer preview kit in the introduction . updated last parameter name ta ble 1 and table 2 . added section 3.4: layout recommendations for nrf24le1 . 28-jun-2013 4 added section 1: bal-nrf01d3 preview and section 3.4: layout recommendations for nrf24le1 .
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